Probe Stations

The XMPS-208 is an 8-inch manual probe station designed for CMOS, GaN, SiC, and MEMS wafer-level characterization. It handles DC parametric measurement, S-parameter sweeps (with our vector network analyzers), high-voltage breakdown testing, and reliability burn-in monitoring. Manual XYZ staging over 210 mm x 210 mm with probing resolution under 2 um supports repeatable contact, and the platform accepts upgrades for high- and low-temperature aging environments as well as load-pull, terahertz, irradiation, and 1/f noise expansions.

Our GPR series RF probes are ground-signal (GS) and signal-ground (SG) wafer probes suited to mmWave S-parameter measurements. Pitch and tip metallurgy are selected based on pad geometry, contact force requirements, and lifecycle expectations. For accurate on-wafer calibration, pair the GPR probes with calibration substrates and the YNA-3674 vector network analyzer.

Yes - thermal chuck options support wafer temperatures up to 300 degrees C for accelerated-life testing, characterization across operating range, and burn-in qualification. Cold-chuck options are available for low-temperature device characterization on request. For fully automated thermal sequences and data capture, our Custom Automation team can integrate the probe station with SCPI-driven test routines.

Verify wafer size, chuck movement, microscope alignment, probe arm travel, contact repeatability, thermal chuck behavior, safety shield, particle-monitoring state, and the measurement path to the SMU, VNA, or analyzer.

Scope RF probes with the station when pad pitch, contact geometry, calibration substrate, cable movement, chuck planarity, or frequency range can affect S-parameter repeatability. The probe sits inside the calibration plane, so its loss and its contact behaviour are measured as part of the device unless the calibration removes them, which is why the probe cannot be treated as an accessory ordered after the station is installed. GPR series probes are specified from DC to 26, 40, 50 or 67 GHz with insertion loss below 0.9, 1.1, 1.2 and 1.3 dB respectively and return loss above 14 dB, so ordering more bandwidth than the device needs gives away margin at the frequencies actually being measured. Pitch follows the pad layout across the 50 to 300 um range rather than the frequency, and the connector interface - SMA, 2.92 mm, 2.4 mm or 1.85 mm - has to match the existing cable set and the station mechanics.