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XGY Tek

Products

Probe Stations

Probe Stations and RF Probes for Semiconductor Wafer Test

XGY Tek supplies manual probe stations and RF probes used in semiconductor fabs, university cleanrooms, and failure-analysis labs. Configurations support wafers up to 8 inches with thermal chuck operation to 300 degC, 0.5 um XYZ manual resolution, up to 6 probe arms, safety shielding, and particle-monitoring options.

The station should be scoped from the DUT and measurement path: wafer size, die pad pitch, DC or RF probe type, GSG pitch, high-voltage or low-current need, triax or coax cabling, chuck temperature, microscope plan, vibration sensitivity, shielding, and exported data workflow.

For station and RF probe planning, see our probe station selection guide. Safety, particle monitoring, and calibration documentation requirements are confirmed during quotation.

Probe Stations product list

Best fit

Chip-level characterization and IC verification using manual wafer probing.

XMPS-208 Probe Station

  • Wafer: 8-inch
  • Key Spec: < 2 um probing resolution
  • Platform: 8-inch wafer, DC to THz
  • Best For: Chip-level I-V/C-V/RF probing
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Best fit

Repeatable on-wafer RF contact for probe-station S-parameter measurement.

GPR Series RF Probe

  • Frequency: DC to 67 GHz
  • Insertion Loss: < 1.3 dB @ 67 GHz
  • Platform: GS / SG, 50-300 um
  • Best For: On-wafer RF measurement
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Selection path

Probe-station selection path

Choose the station around wafer handling and measurement access, then match the RF probe to frequency, contact geometry, and pitch.

Format Model Coverage Best fit
8-inch manual probe station XMPS-208 8-inch wafer; manual XYZ; DC to THz I-V / C-V / RF; < 2 um probing resolution Chip-level characterization and IC verification using manual wafer probing.
GS / SG RF probe GPR Series DC to 26 / 40 / 50 / 67 GHz; 50 to 300 um pitch; 50 ohm Repeatable on-wafer RF contact for probe-station S-parameter measurement.

Frequently Asked Questions

What wafer sizes and applications does the XMPS-208 support?
The XMPS-208 is an 8-inch manual probe station designed for CMOS, GaN, SiC, and MEMS wafer-level characterization. It handles DC parametric measurement, S-parameter sweeps (with our PXIe VNA modules), high-voltage breakdown testing, and reliability burn-in monitoring. Six probe arms allow simultaneous bias, sense, and RF contact. Optional thermal chuck operation to 300 degrees C supports high-temperature reliability studies.
Which RF probe should I choose for on-wafer S-parameter measurement?
Our GPR series RF probes are ground-signal-ground (GSG) wafer probes suited to mmWave S-parameter measurements. Pitch and tip metallurgy are selected based on pad geometry, contact force requirements, and lifecycle expectations. For accurate on-wafer calibration, pair the GPR probes with calibration substrates and one of our PXIe vector network analyzers.
Do XGY probe stations support thermal characterization?
Yes - thermal chuck options support wafer temperatures up to 300 degrees C for accelerated-life testing, characterization across operating range, and burn-in qualification. Cold-chuck options are available for low-temperature device characterization on request. For fully automated thermal sequences and data capture, our Custom Automation team can integrate the probe station with SCPI-driven test routines.
What should be checked before accepting a probe station?
Verify wafer size, chuck movement, microscope alignment, probe arm travel, contact repeatability, thermal chuck behavior, safety shield, particle-monitoring state, and the measurement path to the SMU, VNA, or analyzer.
When should RF probes be scoped with the station?
Scope RF probes with the station when pad pitch, GSG geometry, calibration substrate, cable movement, chuck planarity, or frequency range can affect S-parameter repeatability.

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Selection Guides

Read buyer's guides to choose the right instrument or system for your application.

How to Choose a Probe Station

How to Choose a Probe Station

Read the guide