Products

Probe Stations

Precision Semiconductor Test Systems

XGY probe stations provide the ultra-stable, wafer-level contact essential for rigorous semiconductor failure analysis and precise IC verification. Engineered with 0.5 μm manual XYZ alignment and thermal capabilities up to 300°C for wafers up to 8 inches, they establish a secure, particle-monitored probing environment required to confidently characterize sensitive die-level structures.

XMPS-208 Probe Station

Wafer: 8-inch
Key Spec: < 2 μm probing resolution
Platform: 8-inch wafer, up to 400°C
Best For: Failure analysis & IC verification

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GPR Series RF Probe

Frequency: DC – 67 GHz
Key Spec: < 1.1 dB @ 40 GHz
Platform: GS / SG, 50–300 μm
Best For: On-wafer RF measurement

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Probe Stations and RF Probes for Semiconductor Wafer Test

XGY Tek supplies manual probe stations and RF probes used in Australian semiconductor fabs, university cleanrooms, and failure-analysis labs. Configurations support wafers up to 8 inches with thermal chuck operation to 300°C and 0.5 μm XYZ resolution for precise on-wafer contact. Every probe station ships with safety shield, particle counter, and traceable calibration.

What wafer sizes and applications does the XMPS-208 support?

The XMPS-208 is an 8-inch manual probe station designed for CMOS, GaN, SiC, and MEMS wafer-level characterization. It handles DC parametric measurement, S-parameter sweeps (with our PXIe VNA modules), high-voltage breakdown testing, and reliability burn-in monitoring. Six probe arms allow simultaneous bias, sense, and RF contact. Optional thermal chuck operation to 300°C supports high-temperature reliability studies.

Which RF probe should I choose for on-wafer S-parameter measurement?

Our GPR series RF probes are ground-signal-ground (GSG) wafer probes suited to mmWave S-parameter measurements. Pitch and tip metallurgy are selected based on pad geometry, contact force requirements, and lifecycle expectations. For accurate on-wafer calibration, pair the GPR probes with calibration substrates and one of our PXIe vector network analyzers.

Do XGY probe stations support thermal characterization?

Yes — thermal chuck options support wafer temperatures up to 300°C for accelerated-life testing, characterization across operating range, and burn-in qualification. Cold-chuck options are available for low-temperature device characterization on request. For fully automated thermal sequences and data capture, our Custom Automation team can integrate the probe station with SCPI-driven test routines.