Skip to content

Selection Guide

How to Choose a Probe Station and RF Probes

Plan XGY wafer-size, thermal chuck, RF probe, calibration, and instrument choices for semiconductor wafer-level test.

Updated 2026-06-01

A probe station is a mechanical, electrical, optical, and thermal test platform. The best configuration depends on wafer size, pad pitch, thermal range, RF frequency, leakage-current floor, microscope requirements, and the instruments connected to each probe arm.

Quick Recommendation

Need Best fit Why it fits
Manual wafer-level semiconductor probing XMPS-208 Probe Station 8-inch wafer support, fine manual positioning, thermal chuck options, and multiple probe arms for R&D and failure analysis.
On-wafer RF and S-parameter measurement GPR Series RF Probe DC to 67 GHz RF probes for GS and SG configurations with selectable pitch for on-wafer pads.
Complete RF wafer measurement bench XMPS-208 + GPR probes + PXIe VNA Combines stable wafer contact, RF probes, calibration substrate, and VNA measurement workflow.

Configuration Questions

Question Why it matters
What wafer or die size is required? Chuck size, travel, microscope field of view, and fixture space all depend on sample format.
Do you need thermal testing? Thermal chuck selection affects cables, probe tips, safety shielding, and measurement drift.
What is the highest RF frequency? Probe pitch, calibration substrate, cable choice, and VNA range must all match the RF target.
How low are the currents? Low-current or high-impedance measurements may require shielding, guarding, and careful grounding.

How to Decide

Start with the device and pad geometry

Pad pitch, pad layout, die size, and number of contacts determine probe type and arm count. RF pad geometry must match the GPR probe configuration and pitch.

Plan the instrument chain at the same time

DC parametric work may need SMUs and guarding. RF work needs a VNA, RF probes, calibration substrate, and phase-stable cables. Mixed tests often require both, plus software sequencing.

Account for thermal and safety constraints

High-temperature wafer testing changes contact stability, cable routing, and operator safety requirements. Confirm thermal chuck range, microscope working distance, and enclosure requirements before ordering.

For a probe-station quote, share wafer size, pad pitch, test frequency, thermal range, required probe count, microscope needs, and connected instruments. XGY Tek can configure station, probes, cables, calibration, and support as one bench.