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XGY Tek
8-Inch Wafer

XMPS-208 Probe Station

8-Inch Manual Probe Station - DC to THz Wafer Probing with I-V, C-V, and RF Capability

XGY XMPS-208 is an 8-inch manual probe station for chip-level characterization and IC verification across DC to THz measurements. It combines I-V/C-V/RF test capability, <2 um probing resolution, 210 mm x 210 mm X/Y travel, an 8-inch multi-hole vacuum chuck, and 400X continuous zoom APO objectives.

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XMPS-208 Probe Station

Core Specifications

Key technical parameters for the XMPS-208 Probe Station.

Wafer Size

8 inch

Stage Type

Manual XYZ

Application fit

Match the product configuration to the engineering workflow before quotation.

Use the application fit, workflow and RFQ sections below to turn a product page into a practical engineering shortlist.

Application fit

Chip Level Characterization

XMPS-208 Probe Station should be scoped around chip-level characterization, with voltage, power, interface, protection and acceptance requirements confirmed before quotation.

8-inch< 2 um probing resolution8-inch wafer, DC to THz

Application fit

I V C V RF Test Workflows

XMPS-208 Probe Station should be scoped around I-V/C-V/RF test workflows, with voltage, power, interface, protection and acceptance requirements confirmed before quotation.

< 2 um probing resolution8-inch wafer, DC to THzChip-level I-V/C-V/RF probing

Application fit

DC To THz Measurements

XMPS-208 Probe Station should be scoped around DC to THz measurements, with voltage, power, interface, protection and acceptance requirements confirmed before quotation.

8-inch wafer, DC to THzChip-level I-V/C-V/RF probing8-inch

Application fit

High Low Temperature Probing Workflows

XMPS-208 Probe Station should be scoped around high/low temperature probing workflows, with voltage, power, interface, protection and acceptance requirements confirmed before quotation.

Chip-level I-V/C-V/RF probing8-inch< 2 um probing resolution

High Performance Manual Probe Station

The XGY XMPS-208 is designed for chip-level characterization and IC verification with 8-inch wafer capability, DC to THz measurement readiness, and I-V/C-V/RF test capability.

Typical Applications

  • Chip-level characterization - low-noise I-V/C-V testing with fA-level leakage measurement capability
  • I-V, C-V, and RF test workflows - professional measurement capability on one manual probe-station platform
  • High/low temperature probing workflows - upgrade support for temperature aging environments
  • DC to THz measurement expansion - modular load-pull, terahertz, irradiation, and 1/f noise upgrade paths

Key Advantages

  • Wafer Size 8-inch wafer support
  • Measurement Range DC to THz measurement-ready probe platform
  • Precision <2 um probing resolution with 210 mm x 210 mm X/Y travel
  • Optics 400X continuous zoom APO objectives
  • Expansion Load-pull, terahertz, irradiation, 1/f noise, and high/low temperature upgrade paths

Performance Highlights

  • Wafer 8-inch
  • Key Spec < 2 um probing resolution
  • Platform 8-inch wafer, DC to THz
  • Best For Chip-level I-V/C-V/RF probing

Looking for a custom probe station solution?

XGY Tek specializes in tailoring probe stations to meet specific semiconductor testing and characterization requirements.

Get a Quote

Technical Resources

Download Datasheet

PDF technical specifications

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Pre-filled product inquiry

Fit check

Use this product when the requirement matches the published envelope.

Strong fit

  • Projects centred on chip-level characterization
  • Projects centred on I-V/C-V/RF test workflows
  • Projects centred on DC to THz measurements
  • Requirements that benefit from Wafer Size and Measurement Range

Review alternatives

  • Requirements outside the published voltage, current, power or frequency envelope
  • Projects without a defined DUT, site power, interface or acceptance method
  • Simple bench work where a lower-cost standard supply would meet the requirement
  • RFQs that cannot yet specify protection, cooling, cabling or control boundaries

Quote-stage checklist

The fastest way to make the enquiry useful.

Voltage rangeCurrent / powerOperating modeDUT typeLoad profileControl interfaceProtection needsCooling / installationCable / fixture planCompliance workflowLead timeFAT/SAT evidence

Add the operating profile, safety boundary, control interface and acceptance evidence expected by the buyer before requesting final configuration and lead time.

Quote workflow

Make the test plan visible before the quote is final.

A useful RFQ is a short engineering model: operating envelope, DUT workflow, control boundary and acceptance evidence.

Send RFQ
01

Confirm the electrical envelope

Ratings map

Start with voltage, current, power, frequency, operating mode and site power limits before selecting a model.

02

Define the DUT workflow

Use-case brief

Map the equipment to chip-level characterization; I-V/C-V/RF test workflows; DC to THz measurements and record any transient, cycling, compliance or automation needs.

03

Lock the acceptance package

Quote evidence

Confirm control interfaces, protection requirements, data logging, remote operation and the FAT/SAT evidence needed by the buyer.

Frequently Asked Questions

What should buyers know about XMPS-208 Probe Station?

This product page summarises XMPS-208 Probe Station within XGY Tek's Probe Stations catalogue. Review the published specifications and application notes to determine whether the product matches the intended workflow.

Which published specifications should buyers compare for XMPS-208 Probe Station?

Start with the values highlighted on this page: Wafer Size: 8 inch; Stage Type: Manual XYZ; Measurement Capability: DC to THz; I-V / C-V / RF; X/Y Travel: 210 mm x 210 mm. Check whichever selection criteria apply, such as measurement or operating range, resolution, accuracy, sensitivity, interfaces, software compatibility, environmental limits, accessories, and any stated test conditions. Not every criterion applies to every product.

How should XMPS-208 Probe Station be matched to an application?

Published applications include chip-level characterization; I-V/C-V/RF test workflows; DC to THz measurements; high/low temperature probing workflows. Use the application notes as selection guidance, then confirm the required operating conditions, interfaces, software compatibility, and accessories against the published specifications.

When should buyers compare another option in Probe Stations?

Compare alternatives when the published measurement or operating range, resolution, accuracy, sensitivity, interfaces, software compatibility, environmental limits, or available accessories do not match the intended workflow. Confirm any critical value together with its stated conditions before selecting a configuration.

How can I request a quote or datasheet for XMPS-208 Probe Station?

Use the Get a Quote form to share the application, required configuration, interfaces, accessories, documentation needs, and timing. XGY Tek will review the request before confirming a suitable configuration. A downloadable datasheet is linked from the product page.Get a Quote

What support information is available for XMPS-208 Probe Station?

Support scope is confirmed during quotation. Ask about commissioning, software integration, calibration documentation, acceptance requirements, training, accessories, spares, and service arrangements relevant to the application.About XGY TekWhere to Buy

Looking for a custom probe station solution?

XGY Tek specializes in tailoring probe stations to meet specific semiconductor testing and characterization requirements.

Get a Quote