Probe Stations
XMPS-208 Manual Probe Station
8-Inch Manual Probe Platform for I-V, C-V and RF Tests
XMPS-208 is a manual probe-station platform for wafer and chip characterization. An 8-inch vacuum chuck, 210 × 210 mm X/Y travel, <2 µm probing resolution and continuous-zoom APO optics support I-V, C-V and RF setups.
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- Chuck size
- 8 inch (200 mm)
- Probing resolution
- < 2 µm
- Frequency domain capability
- DC to THz measurements
- Measurement
- Supported tests
- I-V / C-V / RF
- Measurement
Overview
XMPS-208 is a manual probe-station platform for wafer and chip characterization. An 8-inch vacuum chuck, 210 × 210 mm X/Y travel, <2 µm probing resolution and continuous-zoom APO optics support I-V, C-V and RF setups.
Product & Measurement Gallery
Mechanical dimensions — front view
Dimensions in millimeters.
Mechanical dimensions — top view
Dimensions in millimeters.
Additional product details
The XMPS-208 is a DC to THz measurement-ready probe platform that brings professional I-V, C-V, and RF measurement capability together on one manual probe-station platform.
Precision Chip Characterization
The XMPS-208 offers a complete low-noise I-V/C-V testing solution. Its professional three-axis upgrade architecture enables I-V leakage measurements down to the fA level.
Featuring an 8-inch multi-hole adsorptive chuck, the XMPS-208 improves compatibility and contact stability for thin-wafer testing. The XMPS-208 supports upgrades for high/low temperature aging environments and modular expansions for load-pull, terahertz, irradiation, and 1/f noise systems.
Key Capabilities & Applications
Wafer handling and positioning
The 8-inch chuck switches adsorption areas between 8-inch, 6-inch, 4-inch and 4 mm formats. Manual XYZ positioning includes ≥100 mm Z travel.
Optical probing workflow
400× continuous-zoom APO objectives, an HD camera, pneumatic microscope lift and vacuum hold/release support contact setup.
Expandable measurements
DC-to-THz measurement setups and fA-level I-V leakage measurements require the corresponding measurement configuration. Modular expansions include load-pull, THz, irradiation and 1/f noise systems.
Common applications
- Chip-level characterization
- I-V, C-V, and RF test workflows
- High/low temperature probing workflows
- DC to THz measurement expansion
Technical Specifications
| Parameter | Specification |
|---|---|
| Wafer | |
| Chuck size | 8 inch (200 mm) |
| Measurement | |
| Supported tests | I-V / C-V / RFMeasurement |
| DC | |
| X/Y travel | 210 mm × 210 mm |
| Z travel | ≥ 100 mm |
| Probing resolution | < 2 µm |
| Wafer | |
| Optical system | 400X continuous zoom APO objectives |
| Measurement | |
| Leakage performance | I-V leakage accuracy reaches fA levelMeasurement |
| Chuck flatness | ≤10 µm |
View all 16 specifications
| Parameter | Specification |
|---|---|
| Wafer | |
| Adsorption area | Quick switch between 8-inch / 6-inch / 4-inch / 4 mm |
| Stage type | Manual XYZ |
| Measurement | |
| Frequency domain capability | DC to THz measurementsMeasurement |
| DC | |
| Microscope lift precision | ≤ 0.5 µm |
| System | |
| Microscope | Continuous zoom microscope |
| X-axis full-stroke accuracy | ≤2.0 µmTravel ≥210 mm |
| Y-axis full-stroke accuracy | ≤2.0 µmTravel ≥210 mm |
| Chuck pull-out | More than 80% |
Specifications are subject to change without notice.
Models, Configuration & Compatibility
XMPS-208
Control interfaces and software
The manual probing platform combines continuous-zoom APO optics and an HD camera with a stable microscope stand, pneumatic microscope lift, coarse chuck movement and a vacuum hold/release switch. Modular expansions include load-pull, terahertz, irradiation and 1/f noise systems.
Manual positioning · HD camera · Vacuum chuck
Order codes and configuration are confirmed in the quotation.
Technical Resources
Selection guidance
Format: 8-inch manual probe station
Coverage: 8-inch wafer; manual XYZ; DC to THz I-V / C-V / RF; < 2 µm probing resolution
Best for: Chip-level characterization and IC verification using manual wafer probing.
Compare products in the Probe Stations categorySend the operating envelope, configuration and acceptance evidence you need; the quotation confirms model, options and delivery documentation.
